CONDUCTOR/INSULATING RESIN COMPOSIT BODY, SINGLE LAYER CIRCUIT BOARD FORMED OF THE COMPOSIT BODY AND MULTILAYER INTERCONNECTING BOARD USING THE SINGLE LAYER CIRCUIT BOARD

摘要

PURPOSE:To allow reliable electrical connection to a conducting path and bump-shaped conductive protruding part by forming a plurality of penetrating conductive paths and the bump- shaped conductive protruding parts on the insulating resin layer on a base material whereupon a conductive layer is formed on one side. CONSTITUTION:A conductive layer 1 is formed on one side of a low linear expansion insulating resin layer 2, and a thermoplastic insulating resin layer 3 is formed on the other side so as to form a three-layer base material. The insulating resin layers 10 of the base material is provided with a plurality of through holes with a diameter of 10mum or more at intervals of 30mum or more, and the holes are filled with metal materials so as to form conductive paths 7. The 400 to 110,000 conductive paths 7 are formed per 1cm<2> and bump-shaped conductive protruding parts 5 extending from the conductive paths 7 are formed on the top surface of the insulating resin layers 10 (2 and 3). Therefore, the circuit of a single layer circuit board is electrically connected reliably through the bump-shaped conductive protruding parts only by bonding the insulating resin layer side of the single layer circuit board to the conductive circuit side of other single layer circuit board by thermocompression.