| 摘要 |
<p>PURPOSE:To provide an IC module having an electric connecting member in which no disconnection, no peeling of a connection due to expansion, contraction of molding resin caused by heating the module of the member such as a bump, etc., for connecting an IC chip to a wiring pattern. CONSTITUTION:A bump 5 for electrically connecting electrodes of an IC chip 3 to a wiring pattern 4 is formed of conductive resin or an elastic member having conductivity to prevent disconnection of the member, peeling of a connecting part by elastic recoiling force of the bump 4 against deviation of the chip 3 or the member 5 due to expansion or contraction of molding resin 9 caused by heating or cooling at the time of adhering the IC module 10 to an IC card base material.</p> |
