| 摘要 |
PURPOSE:To obtain an epoxy resin composition, containing an acid anhydride- based curing agent, a curing catalyst and a filler in a modified epoxy resin, having a small internal stress without deteriorating the light transmittance and useful for sealing optical semiconductors. CONSTITUTION:The resin composition contains (A) a modified epoxy resin obtained by reacting (i) an epoxy resin with (ii) an organopolysiloxane, (B) an acid anhydride-based curing agent, (C) a curing catalyst and (D) a filter having <=5X10<-3>X[(m)<2>+2]/[(m)<2>--1]}<2/3>mum particle diameter {(m) is the refractive index ratio of the refractive index of the filler to that of a resin cured body of the components [(A), (B) and (C)]; (m)>1.0005 or (m)<0.9995}. Furthermore, the component (ii) is preferably an organopolysiloxane having a functional group reactive with epoxy group and 500-7000 molecular weight and the component (i) is preferably a bisphenol A type epoxy resin or an alicyclic epoxy resin. |
