发明名称 Polyamide resin composition
摘要 The invention relates to a polyamide resin composition comprising (A) nylon 4.6, (B) an aliphatic polyamide having a CH2/NHCO ratio of from 6 to 11 and (C) a non-crystalline polyamide having a glass transition temperature of at least 100 DEG C. The composition has a decreased water absorption while retaining high mechanical strength, heat stability and chemical resistance. Dimensional stability and mechanical properties after water absorption are unexpectedly good.
申请公布号 HK8595(A) 申请公布日期 1995.01.27
申请号 HK19950000085 申请日期 1995.01.19
申请人 DSM N.V. 发明人 KENJI YASUE;TSUNEO TAMURA;AKIO MOTOYAMA;HIROMASA ITAKURA
分类号 C08L77/00;C08L77/06 主分类号 C08L77/00
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