发明名称 A METHOD FOR THE PARTIAL METALLIZATION OF A SUBSTRATE
摘要 <p>A process for the selective metallization of a substrate (10) and the product formed thereby. An extremely thin (substantially less than the wavelength of light) coat of metallic particles is deposited on a transfer agent. A thin coat of varnish (40) is selectively applied to either the substrate (10) or the transfer agent, the substrate (10) or transfer agent are laminated together and the varnish (40) is cured. The metallic particles will become absorbed within the varnish (40) and the substrate (10) and transfer agent are then separated. The substrate (10) is provided with a highly polished specular metallic finish in predetermined areas.</p>
申请公布号 WO1995002461(A1) 申请公布日期 1995.01.26
申请号 US1994007708 申请日期 1994.07.11
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