An electronic element sealing body which has excellent moisture resistance and soldering heat resistance and in which an electronic element is sealed with a synthetic resin wherein at least the extending parts of the lead wires are sealed with a heat resistance composition containing (A) a thermoplastic norbornane resin and (B) heat-resistant resin whose heat deformation temperature is >/= 180 DEG C. An electronic element sealing body which has a transparent sealing part and a heat resistant sealing part, wherein the main body section of the electronic element is sealed with a thermoplastic norbornane resin and the extending parts of the lead wires are sealed with the above-mentioned heat-resistant composition.
