Stromlose Abscheidung von Nickel auf Oberflächen wie Kupfer oder geschmolzenem Wolfram.

摘要

Conductive surfaces such as copper and/or tungsten surfaces, particularly copper circuitry areas of printed circuit board substrates or fused tungsten circuitry areas of fused tungsten-ceramic packages, are activated for receipt of electroless nickel plating thereon by providing the surfaces with particulate zinc metal, particularly by contact of the surfaces with an aqueous suspension of particulate zinc metal.