发明名称 METHOD FOR METALLISING NON-CONDUCTIVE SUBSTRATES
摘要 A method comprising the steps of (a) preparing a divided copper oxide dispersion (4) including a solvent and a selected binder, (b) applying said dispersion to a non-conductive substrate (1) to form a film (5), (c) forming a Cu film (9) with a suitable reagent, and (d) electrolytically depositing at least one metal film (11) on said film (9).
申请公布号 WO9502715(A1) 申请公布日期 1995.01.26
申请号 WO1994FR00860 申请日期 1994.07.11
申请人 TREFIMETAUX;NEGRERIE, MARCEL;DE HOLLAIN, GUY;N'GUYEN, VAN, HUU;INSENGA, SERGE 发明人 NEGRERIE, MARCEL;DE HOLLAIN, GUY;N'GUYEN, VAN, HUU;INSENGA, SERGE
分类号 C09J201/00;C23C18/28;C25D5/56;H01M4/80;H05K3/10;(IPC1-7):C25D5/56 主分类号 C09J201/00
代理机构 代理人
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