Wafer support apparatus.

摘要

In a single wafer processing apparatus including a portable processing head that can be a portable module or a movable unit mounted to a supporting machine frame. The processing head has wafer support apparatus with grippers comprising movable fingers adapted to grip a wafer. The fingers protrude from a protective wafer plate and are mounted within a flexible diaphragm. Indexing and rotation monitoring assemblies are provided for automation of the wafer processing steps. A complementary processing base includes an upwardly-open bowl that receives a wafer held by the portable processing head. It has a full-diameter movable bottom wall for rapid draining purposes. Liquid and/or gas jets and nozzles supply fluids required within the bowl for processing wafers.