| 摘要 |
A surface mount connector including an insulating housing and pairs of an upper and lower pin contacts which comprising terminal pins piercing the housing and being in vertical alignment and partially in a bifurcated pattern, in each pair. Each pin contact has a lead 15A or 15B integral with its base portion 15A or 15B and solderable to a pad on a printed circuit board. The leads are included in a single plane intermediate two further planes in which the upper and lower terminal pins respectively, respectively extend, respectively. A bottom contact surface of each lead protrudes downwardly between stepped regions of the lead. The insulating housing is partially cut off at its lower corner under the leads so as to provide a cutout tightly engageable with a side edge of the printed circuit board, so that visual inspection and correcting of soldered leads of the connector is facilitated, while ensuring reliable soldering of the leads, and further reducing the size and height of the connector from the board. |
