| 摘要 |
The present invention provides an apparatus for recognizing the shape of a semiconductor wafer, capable of stably achieving accurate shape recognition without being affected by a circuit pattern formed on the semiconductor wafer. The shape recognizing apparatus in accordance with the present invention comprises an illuminating means (1) for illuminating a semiconductor wafer (100), an image pickup means (3) for picking up an image of the semiconductor wafer (100) and providing video signals representing the image, disposed so that specular light reflected by the semiconductor wafer (100) will not fall thereon, and a shape recognizing means (6) which processes the video signals to recognize the shape of the semiconductor wafer (100), a first polarizing means (7) is disposed on a light path along which the illuminating light emitted by the illuminating means (1) travels, and a second polarizing means (8) is placed on a path along which reflected light from the semiconductor wafer (100) travels toward the image pickup means (3). |
