| 摘要 |
PURPOSE:To form a flow stopper frame for sealing resin, and make thinner a chip carrier and improve the reliability of the same by skiving an internal layer die pad and a bonding pad from a multi-layered laminate member rendered to heating pressurizing lamination. CONSTITUTION:A laminate member including a bonding pattern and a die pad pattern therein as an internal layer is drilled and is rendered to copper plating, and thereafter a surface layer pattern is formed on the laminate member. Thereafter, the internal layer die pad 3 and the bonding pad 2 are skived and exposed, and are further rendered to nickel and gold plating 11 for processing of the external appearance of the laminate member, whereby a plastic chip carrier including a resin flow stopper 13 is formed. Hereby, the die pad portion is prevented from being bent to make thinner the chip carrier. Further, the chip carrier is ensured, which is made very thin with high reliability and in which strong copper adhesion force is ensured and a flat die pad is provided, and further in which the resin flow stopper frame and the substrate are integrally formed for strong adhesion force therebetween. |
