| 摘要 |
<p>PURPOSE:To provide a hybrid integrated circuit on which a connector lead is firmly joined to a conductor foil pattern. CONSTITUTION:Means for decreasing heat conduction, such as holes 31 for decreasing heat conduction from a soldering portion to a high heat-conducting metallic circuit substrate 3, are provided near the soldering portion for the conductor foil pattern 9 and the connector lead 13 of the high heat-conducting metallic circuit substrate 3. During soldering, the heat that escapes toward the entire high heat-conducting metallic circuit substrate 3 from the soldering portion is effectively decreased by the means for decreasing heat conduction, and thereby the conductor foil pattern 9 can be firmly soldered to the connector lead 13 and the mechanical strength of the soldering portion is remarkably enhanced.</p> |
