RESIN SEALED TYPE SEMICONDUCTOR DEVICE

摘要

PURPOSE:To adequately prevent resin crack of a small and thinner of resin sealing layer by loading a semiconductor element on a chip loading area and molding the surrounding of the chap loading area having loaded a semiconductor element with a resin sealing material including fine pieces of fluorine resin porous material. CONSTITUTION:A semiconductor element 10 is loaded on a chip loading material 11 and an electrode of the semiconductor element 10 and a lead 12 are connected with a gold fine wire 14 having excellent electrical characteristic. The chip loading material 11 is surrounded and sealed by a molding resin 13 including fine pieces 15 of fluorine resin porous material. Thereby, generation of crack in the mold resin 13 due to alleviation and absorption of internal stress can be adequately prevented even when temperature changes suddenly during the soldering process and thermal stress is applied after humidity is absorbed.