MANUFACTURE OF MULTILAYER CERAMIC CIRCUIT BOARD

摘要

PURPOSE:To provide a manufacturing method of a multilayer ceramic circuit board with a solder joint part among a plurality of ceramic circuit boards for reducing occurrence of crack at a multilayer process. CONSTITUTION:An object 4 containing solder is included among a plurality of laminated ceramic circuit boards 3 and solder is melted by heating under pressure and then is cooled, thus obtaining a multilayer ceramic circuit board with a solder joint part. When manufacturing the multilayer ceramic circuit board, a sheet-shaped electrical heating element 7 is pressed to the entire upper and lower surfaces outside the plurality of laminated ceramic circuit boards 3 and then is pressurized and heated.