| 摘要 |
<p>PURPOSE:To maintain the intervals between semiconductor chips with time by a method wherein a tape mounted with the chips is fixed on a base using a double-side adhesive tape. CONSTITUTION:A double-side adhesive tape 7 is adhered on the inner surface of a groove 5 cut in an expanded ring 4, which is used as a base, and on the outer peripheral surface of the ring 4 on the periphery of the groove 5. Then, a tape 2 mounted with semiconductor chips 1a split into the number of prescribed pieces is arranged on the upper part of the ring 4 and after dicing rings are fixed on the peripheral edge part of the tape 2, the dicing rings are lowered down to expand the tape 2. Then, a shrinkage protective band 6 is fitted in the groove 5 cut in the ring 4, the expanded tape 2 is pressed to the tape 7 to fix on the tape and the return of the tape 2 due to shrinkage is prevented from being generated. Thereby, the clearances between the chips on the tape 2 can be stably maintained and an integrated circuit having a high dimensional accuracy can be manufactured on the chips.</p> |
