| 摘要 |
PURPOSE:To apply an interconnector in integrated circuits or circuit boards which are connected to the interconnector in a high circuit density by forming a number of electrical interconnecting portions (vias) that constitute the interconnector, in such a way that the ratio of the length H to the diameter W of each of them, i.e., H/W, becomes a high value. CONSTITUTION:An interconnector for transmitting a number of electric signals among a number of integrated circuits or circuit boards has a nonconducting main body 52, a number of conductive vias 24 each taking the form of a truncated cone stacked one atop another, and through holes in a high density. |
