发明名称 Semiconductor processing apparatus and module
摘要 Semiconductor processing equipment includes an ID-card removing robot, an ID-card stocking device, and an ID-card attaching robot so that the management of ID cards is performed inside the equipment. Thus, the present invention makes it possible to reduce equipment size and achieve highly efficient factory automation. Furthermore, in a semiconductor processing equipment module according to the present invention, each item of semiconductor processing equipment has its own ID-card stocking device. As a result, the number of case carriers can be reduced and a space reduction with increased factory automation can be easily realized.
申请公布号 US5383482(A) 申请公布日期 1995.01.24
申请号 US19920970471 申请日期 1992.11.02
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 YAMADA, YOSHIAKI;IWASAKI, JUNJI;OHMORI, MASASHI
分类号 H01L21/02;H01L21/00;H01L21/304;H01L21/677;(IPC1-7):B08B3/02 主分类号 H01L21/02
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