Package for parallel subelement semiconductor devices

摘要

A package for semiconductor devices with plural subelements and method of packaging. Semiconductor power devices may include plural subelements to increase device manufacturing yield. Each subelement is separately contacted through the lid of the package by attaching a foil to a subelement contact and depending a tab from the foil that extends through the lid. Tabs for operative subelements can be connected external to the package, and tabs for inoperative subelements may be left unconnected or covered so that electrical connections cannot be made therewith.