| 摘要 |
<p>PURPOSE:To prevent a risk for damaging an internal conductor pattern on thermocompression for a multilayer circuit board where an insulation layer and a conductor pattern are multilayered alternately on a substrate. CONSTITUTION:In a multulayer circuit board where surface-mount parts are packaged by performing thermocompression of a lead tip part on a foot pad 10 which is arranged and formed on a surface insulation layer, no internal conductor pattern through a position directly below the foot pad 10 is formed on an inner insulation layer 2S2 of the immediate lower layer of at least surface insulation layer 251.</p> |
