| 摘要 |
<p>PURPOSE:To provide a processing method wherein the rear side of an ultra-thin type resin-sealed semiconductor device wafer can be safely polished and diced without causing damage to the wafer. CONSTITUTION:A protecting.reinforcing tape 2 is pasted on the surface of an ultra-thin resin-sealed semiconductor device wafer 1, the rear side of the wafer 1 is polished, the wafer 3 is transferred to a dicing process after polishing, a dicing tape 4 is pasted on the rear side of the wafer 3 keeping the surface protecting-reinforcing tape 2 pasted on the front side of the wafer 1, then the protecting-reinforcing tape 2 is separated off, and then the wafer 3 is diced. A method of separating off the protecting-reinforcing tape 2 pasted on the surface of the wafer 3 is such that the tape 2 is separated off after the wafer 1 is irradiated with ultraviolet rays so as to lessen adhesive agent in adhesive strength or a separating tape 9 whose adhesive power to the protecting.reinforcing tape 2 is larger than that of protecting.reinforcing tape 2 to the front side of the wafer 1 is used to separate off the tape 2.</p> |
