| 发明名称 |
LEAD FRAME WITH WIRING BOARD |
| 摘要 |
<p>PURPOSE:To obtain a highly reliable lead frame with a wiring board which provides good heat radiation properties and from which molding resin is hardly peeled off. CONSTITUTION:A radiation plate 12 made of metal is used as a wiring board. On one of the surfaces of the wiring board on which a semiconductor chip is mounted, a wiring pattern 18 is formed with an electrical insulating layer 16 therebetween and the inner leads of a lead frame 6 are bonded to the wiring pattern 18. Further, a resin layer 14 whose outer surface is formed into an uneven surface is applied to the other surface of the wiring board.</p> |
| 申请公布号 |
JPH0722566(A) |
申请公布日期 |
1995.01.24 |
| 申请号 |
JP19930165412 |
申请日期 |
1993.07.05 |
| 申请人 |
SHINKO ELECTRIC IND CO LTD;MITSUBISHI PLASTICS IND LTD |
发明人 |
TANAKA MASATO;AZUMA MITSUTOSHI;MIYASAKA SHUNJI;YOSHIKAWA KAZUO;KAJIYASHIKI MAKOTO |
| 分类号 |
H01L23/12;H01L23/28;H01L23/50;(IPC1-7):H01L23/50 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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