| 摘要 |
PURPOSE:To keep the flatness of a printer-circuit board uniform and with high accuracy and to make the production of a bridge between lend wires for an LSI extremely small in a reflow soldering operation by a method wherein an adhesive silicone rubber layer which is composed of the hardened substance of an addition hardening-type liquid silicone rubber compound is former on a flat board. CONSTITUTION:An SUS-made metal flat board 2 is coated uniformly with an adhesive silicone rubber layer 1 in a film thickness of 500mum. A thin board 3 is flattened and fixed to the SUS-made metal flat board 2 by the adhesive force of the adhesive silicone rubber layer 1. As the flat board to be used, a metal flat board, a plastic flat board, a ceramic flat board or the like is enumerated. In addition, it is desirable that the adhesive force of the adhesive silicone rubber layer formed on the flat board is at 10g/25mm to 1000g/25mm and that the thickness of the silicone rubber layer is uniform at 10 to 1000mum. Since the adhesive silicone rubber layer is formed over the whole face of the thin board, the thin board can be positioned, attached or removed easily when it is fixed, and the title fixation jig can be automated. |
