| 摘要 |
PURPOSE:To enable a high-density wiring while maintaining a non-viscosity in cases other than wiring by specifying the ratios among a solid epoxy resin, a polyfunctional epoxy resin, an epoxy modified polybutadiene in a molecule and a cationic photopolymerization initiator, and a tin compound. CONSTITUTION:An epoxy resin having a molecule of 5000 or more end is solid at room temperature, a polyfunctional epoxy resin with an epoxy group of 3 or larger, an epoxy modified polybutadiene within a molecule with an epoxy group of 3 or more, a cationic photopolymerization initiator, and a tin compound are included and then the composition ratios are (a+b+c);a which ranges from 100;40 to 100;70 in terms of weight ratio, (a+b+c);b which is equal to or larger than 100;10 in terms of weight ratio, (a+b+c);c which ranges from 100;10 to 100;40, and (a+b+c);d which is up to 100;5 in terms of weight ratio. Therefore, a multi-wire wiring board does not include a void at an adhesion layer for wiring and fixing a wire, thus improving reliability with a high density. |
