| 摘要 |
PURPOSE:To prevent a defective contact such as a wire discontinuity at a level difference by filling up a contact hole once with a resin and then removing the resin from the central part and reshaping the inner peripheral portion. CONSTITUTION:On the surface of an insulating substrate 1 on which a lower wiring 2 was formed by patterning, at least two insulating films 3 and 4 having different compositions are formed on the whole surface. In addition, an upper wiring 5 is formed by patterning on the surface of insulating film 4. Moreover, a contact hole 6 is formed by giving continuous etching treatment to the two layers of insulating films 3 and 4 and, at that time, side etching is advanced by the difference in etching grate and a cavity 7 is produced. A resin wall 8 is provided at the inner peripheral portion of the contact hole 6 to bury the cavity. The upper wiring 5 is guided to the inside of the contact hole 6 along said resin wall and then is electrically connected to the lower wiring 2 exposed at its bottom. The upper wiring 5 does not pass through any level difference portion within the contact hole 6, so that the occurrence of previous defects such as wire discontinuity at level difference can be prevented. |
