发明名称 |
Semiconductor chip mounting method and apparatus |
摘要 |
The three-dimensional shape of the surface of a board (12) is measured, and the parallel degree between the board (12) and a semiconductor chip (10) is adjusted on the basis of the measurement result. A board mounting means (13) and a semiconductor chip holding means (11) are moved close to each other, and the semiconductor chip (10) is mounted on the board (12).
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申请公布号 |
US5384000(A) |
申请公布日期 |
1995.01.24 |
申请号 |
US19940205416 |
申请日期 |
1994.03.03 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
NISHIGUCHI, MASANORI |
分类号 |
H01L21/60;H01L21/68;H05K13/04;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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