| 摘要 |
An integrated circuit testing system (10) for testing small quantities of integrated circuit die. The testing system (10) includes an integrated circuit tester (15) and a base printed wiring board interface (11) that physically and electrically interfaces thereto. A die holder (12) that holds an integrated circuit die (16) is coupled to the base printed wiring board interface (11). A flexprint structure (13) comprising first and second flexible contact structures (13) is provided that electrically connect to the base printed wiring board interface (11), to pads (22) on the integrated circuit die (16), and to each other to provide for electrical connection between the tester (15) and the die (16). A plurality of alignment pins (14) are provided for aligning the first and second flexible contact structures (13) to each other and to the pads (2) on the integrated circuit die (16). The present invention is specifically designed for testing low quantities of small and large die (16), such as application specific integrated circuits (ASIC), without attaching the die to a substrate and wire bonding it for test purposes. The testing system (10) is versatile in that it can test a variety of pad patterns on the die (16). The system (10) is relatively low cost and has a low cost per operation. Furthermore, the system (10) provides for high test accuracy and good quality contact to the die (16). <MATH> |
