| 摘要 |
PURPOSE:To eliminate delivery variation, cobwebbing, etc., of conventional die-bonding paste, for better workability and no void occurrence, and further to cope with any chip size. CONSTITUTION:The process wherein a bonding agent 1 is, with a thermoplastic resin used as a base binder, applied and then dried on a carrier film 2 as film- state and in wafer-size, so that a carrier sheet with a bonding agent is manufactured, and the process wherein the bonding agent 1 of the carrier sheet with a bonding agent is thermally transferred onto the rear surface of a wafer 4 then a wafer with a bonding agent is provided. Further, the process wherein the wafer with a bonding agent is diced for division into semiconductor elements 8 with bonding agent 1, and the process wherein the semiconductor elements 8 with bonding agent is peeled from a dicing tape 7 and then thermally adhered by pressing to an adherend 12 are included in a semiconductor element mounting method. |
