| 摘要 |
<p>PURPOSE:To make it possible to eliminate variations in setting from operator to operator and from equipment to equipment by providing a parameter setting means to set spark discharge control parameters using digital data. CONSTITUTION:A ball formation equipment for semiconductor wire bonding is to form a ball 1a at the end of a wire 1 through spark discharge at an electric flame off electrode 3. The equipment is provided with a parameter setting means P to set parameters to control spark discharge using digital data. The ball formation equipment consists of, for example, a serial communication control circuit 13; the circuit controls the transmission and receiving of serial receiving data S2 and serial transmission data S3 that provide a wire bonder controller with ball formation conditions and discharge state output, respectively. In addition the equipment may include a discharge current setting circuit 14 that produces discharge current command value S5 output and a discharge time setting circuit 15 that produces discharge time command value S7 output.</p> |
