| 摘要 |
An addition-curable type organopolysiloxane composition having a volume resistivity of 107 OMEGA cm or below, comprising (A) an organopolysiloxane having at least two alkenyl group in its molecule and a viscosity at 25 DEG C. of from 100 to 200,000 cSt, (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in its molecule, (C) a platinum group metal catalyst, (D) an organosilicon compound which has at least one silicon-bonded hydrogen atom in its molecule and in which at least one member selected from the group consisting of epoxy group-containing organic groups and alkoxy groups is attached to a silicon atom, and (E) an electrically conductive filler. This composition can be cured by an ultra high frequency heating system to form an adhesive cured product. It is therefore possible to obtain cured products with stable physical properties under constantly fixed conditions irrespective of the heat capacity of adherends.
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