| 摘要 |
PURPOSE:To prevent generation of bubbles in a resin body formed by resin sealing of a semiconductor chip on a lead frame of a resin sealed type semiconductor device. CONSTITUTION:An interval between an island portion 3a and a lead member 1 of a lead frame located at the preceding stage side of resin injecting direction in a metal die is expanded to enlarge an opening area, the subsequent stage side is narrowed to reduce an opening area to give difference in the flow resistances of these opening areas, the molten resin injected from a gate 21 is caused to flow to the subsequent stage side from the preceding stage side without any inverse flow from the subsequent stage side to certainly push the air in the cavity 23 out of the metal die with the resin injection pressure. |
