发明名称 MOLDING DIE FOR ELECTRONIC COMPONENT
摘要 PURPOSE:To lessen the weight of parts to be replaced and thereby to facilitate an operation of replacement by providing a plurality of transfers, plungers and pots in a bottom tool die set part, by providing cavities, ejector pins and guide mechanisms therefor in upper and lower chases parts respectively and by replacing only the upper and lower chase parts at the time of replacement of the kind of product. CONSTITUTION:A pot part 16, plungers 11 and a plunger holder are built in a bottom tool die set part 23. Ejector pins, a guide mechanism 22 therefor and a bottom tool cavity are provided in a lower chase part 27, while a runner, a top force cavity, ejector pins and a guide mechanism 22 therefor are provided in an upper chase part 28. The lower and upper chase parts 27 and 28 are fitted in die set parts 23 and 24 and positioned and fastened by presser blocks 29 respectively. According to this constitution, only the lower and upper chase parts 27 and 28 need to be replaced on the occasion of replacement of the kind of electronic component package.
申请公布号 JPH0716879(A) 申请公布日期 1995.01.20
申请号 JP19930157956 申请日期 1993.06.02
申请人 M TEX MATSUMURA KK 发明人 WATANABE TAMIO;MORIYA TOSHIHARU
分类号 B29C45/02;B29C45/14;B29C45/26;B29L31/34;H01L21/56;(IPC1-7):B29C45/26 主分类号 B29C45/02
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