发明名称 Method of soldering insulated wire with uninsulated end into circuit board soldering hole
摘要 The method involves bending the uninsulated end (2) of the wire (1) into a U- or V-shaped hook with a bending position and inserting it into the solder hole (4) in the circuit board (3) so that the bending point (6) protrudes out of the other side of the hole. Soldering is then performed on both sides of the board so that part of the insulated wire is permanently enclosed by the solder. The method is used for flexurally and motionally elastic mounting of electrical components or assemblies.
申请公布号 DE19528315(A1) 申请公布日期 1996.12.12
申请号 DE1995128315 申请日期 1995.08.02
申请人 TEMIC TELEFUNKEN MICROELECTRONIC GMBH, 74072 HEILBRONN, DE 发明人 SCHIRMER, KLAUS, DIPL.-ING., 85049 INGOLSTADT, DE
分类号 H01R43/02;H05K3/34 主分类号 H01R43/02
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