Dickschicht-Substrat auf metallischer Grundlage mit hoher thermischer Leitfähigkeit.

摘要

A hybrid thick film substrate (12) utilizes a highly thermally conductive base metal such as copper. The base metal (32) is passivated by a suitable technique to prevent oxidation. One or more dielectric layers (36) are then screened onto the passivation layer (34) and fired at temperatures upwards of 600 DEG C. The surface of the substrate is then in a condition to accept formation of a conductive pattern (14) or the like.