Bonding head, in particular for ultrasound bonding

摘要

A bonding head, in particular for ultrasound bonding, having a die (wedge 11) which is arranged on an ultrasound transducer (10), by means of which an electrically conductive wire (12) can be pressed, with ultrasound excitation, against a contact surface (25) of an electrical or electronic component, and having a wire clamp (13) which is arranged in front of the die (wedge 11) and can move in a reciprocating manner (double arrow 27) in the wire direction. The die (wedge 11) can move up and down, together with the wire clamp (13) and its drive (14; 15), in a direction approximately at right angles to the contact surface (25). Furthermore, the bonding head (26) is mounted such that it can pivot about an axis (17) at right angles to the contact surface (25). The drive for the reciprocating movement of the wire clamp (13) is a translation drive (16) which moves the wire clamp (13) exactly parallel to the wire (12).