Bornitridmembran in einer Halbleiterplättchenstruktur.
摘要
<p>A laminated structure includes a wafer member with a membrane attached thereto, the membrane being formed of substantially hydrogen-free boron nitride having a nominal composition B3N. The structure may be a component in a mechanical device for effecting a mechanical function, or the membrane may form a masking layer on the wafer. The structure includes a body formed of at least two wafer members laminated together with a cavity formed therebetween, with the boron nitride membrane extending into the cavity so as to provide the structural component such as a support for a heating element or a membrane in a gas valve. In another aspect borom is selectively diffused from the boron nitride into a <100> surface of a silicon wafer. The surface is then exposed to EDP etchant to which the diffusion layer is resistant, thereby forming a channel the wafer member with smooth walls for fluid flow.</p>
申请公布号
DE69014759(D1)
申请公布日期
1995.01.19
申请号
DE1990614759
申请日期
1990.07.09
申请人
REDWOOD MICROSYSTEMS, INC., MENLO PARK, CALIF., US
发明人
AMERICA, WILLIAM G., BETHEL, CT 06801, US;POOLE, RICHARD R., NORWALK, CT 06850, US