| 摘要 |
The invention relates to multilayer printed circuit boards, foil printed circuitboards and metal-clad laminates for foil circuit boards and to a process for the manufacture thereof, with interfacial connections (12) structured in insula-tor layers (2), with resist openings (4, 4') of surface (O, O') structured in resist coatings (A, A'), with current paths (SP) structured in conductor layers and with contact points (K, K') and in which for reducing the number of photochemical structurings or patternings required the interfacial connections (12) and resist openings (4, 4') are mechanically structured, in that interfacial connec-tion openings (10, 10') preworked in insulator layers (2) are etched according to interfacial connection structures (8, 8') of mask foils (7, 7'), that in the interfacial connection openings (10, 10') are deposited electrically conductive deposition substances for the formation of contact layers (11) in said openings (10) and in that in the coating layers (A, A') are etched resist openings (4, 4'according to contacting structures (3, 3') of mask foils (7, 7'), so that the resist openings (4, 4') form resist materialfree areas on the circuit boards, foil circuit boards and metalclad laminates for foil circuit boards and the resist openings (4, 4') are worked in freely shaped manner and have circular cylindrical, circu-lar, oval, square, rectangular or polygonal diameters. |
