发明名称 Method and apparatus for adjustment of spacing between wafer and PVD target during semiconductor processing.
摘要 <p>A heater and pedestal actuator (50) is provided to actuate the pedestal (34) of a deposition chamber (10) from a first position (12) wherein a wafer (30) may be placed thereon to a second position (14) adjacent to the deposition target (16). To adjust the inward travel of the heater (32) to compensate for target (16) erosion, the actuator (50) includes a worm drive apparatus (76) driven by a stepper motor (66). The worm drive (76) is pitched, and the stepper motor (66) is selected, to allow fine movement of the heater (32) on the order of less than .01 mm for each arcuate step of the stepper motor (66). A computer (400) is used to actuate the stepper motor (66), and cause additional stepper motor actuation, to increase the travel of the heater (32) toward the target (16) to compensate for target (16) erosion. Additionally, the computer (400) may vary the speed of the worm drive (76) rotation, to create different heater (32) travel speeds within the chamber (10). <IMAGE></p>
申请公布号 EP0634782(A1) 申请公布日期 1995.01.18
申请号 EP19940111179 申请日期 1994.07.18
申请人 APPLIED MATERIALS, INC. 发明人 TEPMAN, AVI
分类号 C23C14/34;H01L21/203;H01L21/68;H01L21/687;(IPC1-7):H01L21/00 主分类号 C23C14/34
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