发明名称 |
Semiconductor device having semiconductor body embedded in an envelope made of synthetic material. |
摘要 |
Semiconductor device with a wiring pattern 3, 6 provided with an insulating layer 4 embedded in an envelope 5 made of synthetic material. To prevent hair cracks in the insulating layer 4, the thickness of the insulating layer 4 is so chosen that the lowest point of top 8 of the insulating layer 4 is at a higher level than the highest point of the wiring pattern 3, 6. |
申请公布号 |
EP0393757(B1) |
申请公布日期 |
1995.01.18 |
申请号 |
EP19900200894 |
申请日期 |
1990.04.12 |
申请人 |
PHILIPS ELECTRONICS N.V. |
发明人 |
BELLERSEN, MICHAEL FRIEDRICH BRUNO;GOOTZEN, WILHELMUS FRANCISCUS MARIE |
分类号 |
H01L23/29;H01L23/31;(IPC1-7):H01L23/31 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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