发明名称 Semiconductor device having semiconductor body embedded in an envelope made of synthetic material.
摘要 Semiconductor device with a wiring pattern 3, 6 provided with an insulating layer 4 embedded in an envelope 5 made of synthetic material. To prevent hair cracks in the insulating layer 4, the thickness of the insulating layer 4 is so chosen that the lowest point of top 8 of the insulating layer 4 is at a higher level than the highest point of the wiring pattern 3, 6.
申请公布号 EP0393757(B1) 申请公布日期 1995.01.18
申请号 EP19900200894 申请日期 1990.04.12
申请人 PHILIPS ELECTRONICS N.V. 发明人 BELLERSEN, MICHAEL FRIEDRICH BRUNO;GOOTZEN, WILHELMUS FRANCISCUS MARIE
分类号 H01L23/29;H01L23/31;(IPC1-7):H01L23/31 主分类号 H01L23/29
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