| 摘要 |
<p>A sputtering target (20) having plastically deformed grains (22) is etched with a wet chemical etchant to remove at least a portion of the plastically deformed grains (22) from the surface of the target (20). After etching, the target (20) is mounted in a sputtering zone, and material is sputtered from the target (20) onto a substrate. <IMAGE></p> |
