A blister-type package includes one or more items (1) sandwiched between a backing (2) and a thermoplastic film (3) which is sealed to the backing along a closed line (4), external to the item(s) to be packaged. The thermoplastic film is mono- or bi-axially oriented when applied to the backing and, after application thereto, is heat shrunk so as to be tensioned over the item(s) and secures the item(s) to the backing. A method of making such a package also is disclosed.
