| 摘要 |
PURPOSE:To reduce the number of processes and to form a high-density pattern by simultaneously forming a surface via hole plating and a feedthrough through hole plating and providing a recessed surface via hole pattern and a recessed pad inner surface via hole pattern. CONSTITUTION:First, a via hole 3a is formed by drilling in a lamination plate 2a with an arbitrary inner-layer conductor 1a, thus filling a dissolution type resin 4a and then performing thermosetting. Then, mechanical polishing is performed to eliminate the dissolution type resin 4a remaining on the surface of the lamination plate 2a and then a desired pattern 5a is formed only on a single-surface layer. Then, the lamination plates 2a and 2b are prepared, inner-layer patterns 5a and 5b are allowed to face inside, heating and pressurization lamination is performed via a prepreg to obtain a lamination forming substrate 7a which is formed into one piece by a prepreg layer 6a. |
