摘要 |
PURPOSE: To provide a one-side closed feed-through which is simple in structure for a ceramic substrate of a thin film circuit, and manufacture thereof. CONSTITUTION: This feed-through for a ceramic substrate 11 of a thick film circuit has a through-hole 14, having a conductive layer 16 at an inner wall 15. This layer 16 is connected to conductor tracks on both sides 12, 13 of a ceramic substrate 22. One opening of the through-hole 14 is closed with inorg. layers 17, 18 which are composed of at least one layer 17 which is adjacent the conductive layer 16 on the ceramic substrate 11 and a sealing layer 18. |