| 摘要 |
PURPOSE:To enable an integrated circuit, device composed of a support substrate and a mounted substrate pasted on it to be lessened in thickness, dicing time required for cutting, and parasitic effect caused by the mounted silicon board. CONSTITUTION:An integrated circuit device is composed of a semi-insulating GaAs substrate 1 where transistors 2 are formed on its primary surface and a silicon dioxide thin film 3 where capacitors 4 and inductors 5 are formed on its primary surface. The semi-insulating GaAs substrate 1 and the silicon dioxide thin film 3 are bonded together making their primary surfaces confront each other as they are electrically connected together through conductive bumps 7. |
