| 摘要 |
PURPOSE:To enable a resin-sealed semiconductor device to be enhanced in signal transmission speed, lessened in electric noises, and improved in soft-error resistance without deteriorating it in degree of integration, heat dissipation properties, and productivity. CONSTITUTION:Electrodes 2, 2,... are arranged on a straight line 20 which traverses the circuit forming plane of a semiconductor element 1, and power supply wiring films 6 and 7 connected to power supply electrodes 2s and 2c out of the electrodes 2 are provided outside the electrodes 2, 2,.... |
