METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide a semiconductor device assembling method or especially a molded plastic IC assembling method and a manufacturing apparatus thereof. CONSTITUTION:A first process wherein a single semiconductor chip 1 is fixed by a semiconductor chip fixing structure 2, and a wire 6 is bonded between an inner lead 4 of a lead frame 3 provided with no die stage and a pad 5 provided onto the semiconductor chip 1 and a second process wherein the wire- bonded single semiconductor chip 1 and the lead frame 3 provided with no die stage are sealed up with molding resin 7 are provided. Therefore, a semiconductor manufacturing equipment possessed of a mechanism which enables the semiconductor chip 1 to be fixed by the fixing structure 2 and wire-bonded to the lead frame 3 provided with no die stage is used.