| 摘要 |
<p>PURPOSE:To provide an automatic device for attaching protective tape to semiconductor wafers in which semiconductor wafers can be easily placed on a working bench, and the replacement of cutters is easy. CONSTITUTION:This device is provided with a mechanism 100 for feeding a protective tape T to a wafer, a mechanism 200 for removing and collecting the separator S, a front loading mechanism 300 for driving a working bench loaded with the wafer in front of the device and a tape tension mechanism 400 for tensioning the protective tape T in the width direction, a mechanism 500 for attaching a protective tape T to the wafer, a cutter unit 700 for cutting off the protective tape T along the outer periphery of the wafer, a tape winding mechanism 800 for winding up the used tape, and a mechanism 600 for swinging the cutter unit 700.</p> |
