| 摘要 |
A method for manufacturing a semiconductor device having a diffusion region formed within a source. A one-conductivity type well is created in a semiconductor substrate, and marked off with field oxide layers. An insulating layer for holding charges is formed on a portion of the surface of the one-conductivity type well, onto which a conductive layer is applied. The insulating layer and the conductive layer are both etched to produce a memory charge storage and a control gate electrode, respectively. An opposite-conductivity type drain and source are formed in the one-conductivity type well. A one-conductivity type diffusion region is then formed within the opposite-conductivity type source, resulting in a memory cell having superior reliability.
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