| 摘要 |
PURPOSE:To provide a method and device for forming a blind holes easily regardless of the scattering in the thickness of each layer and entire part of a multilayer wiring board. CONSTITUTION:A conductive drill 10, a control part 26 for controlling the conductive drill, electrical connection members 22a-22d with the conductive layer of a multilayer wiring board 2, and a power supply 20 and current detectors A1-A4 for detecting electrical continuity between the connection member and the conductive drill 10 are provided. The control part 26 stops the advance of the conductive drill 10 from the upper-surface side of the multilayer wiring board 2 based on the current detection signal from the current detectors A1-A4 which are electrically connected to the targeted conductive layer of the multilayer wiring board 2, thus forming blind holes up to the conductive layer. |
