发明名称 LEAD FRAME AND MOLD DIE
摘要 PURPOSE:To suppress the generation amount of side burr caused after resin molding and delete an influence of the side burr exerted on an outer dimension of a frad frame and process with high precision and resolve a problem that the side burr drops when carrying the lead frame. CONSTITUTION:A lead frame is set in a set recess part of a lead frame 12 of a mold die 10 and a dierunner 16 extends onto the lead frame 12 crossing side edge of a rail part to be molded with resin. A cutout part 18 that has a size larger than a width passing an all width of the dierunner 16 in a side edge of the rail part crossing the dierunner 16, and that has a side edge part positioned by using a position of a guide hole 12a provided in a lead frame material as a reference and engaged with an end edge of a projection 20 provided so as to project from an inner wall surface of the set recess part is provided.
申请公布号 JPH0714964(A) 申请公布日期 1995.01.17
申请号 JP19930150324 申请日期 1993.06.22
申请人 APIC YAMADA KK 发明人 OKAMURA KATSUMI
分类号 B29C45/02;B29C45/14;B29C45/36;B29L31/34;H01L21/56;H01L23/50;(IPC1-7):H01L23/50 主分类号 B29C45/02
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